Available on the US market
Polymax® ED-P4 is commonly used in the stabilization of electroless copper plating baths. Recommended used levels are 0.25 - 1.0% in the bath.
Polymax® ED-P4 belongs to a line of products developed for plating applications. The Polymax® materials offer a variety of functions in both electroless and electrolytic plating baths. Low treat rates and a diversity of chemistries offer economic and formulation options in numerous types of baths.
Properties and applications
Product advantages:
- perfect chelator,
- stabilizer in electrolyte solutions,
- low-foaming agent.
Applications:
- metal processing,
- electroplating processes,
- electronics industry.
Categories
Alternative names
Manufacturer: PCC Chemax Inc.
PCC Chemax Inc. is specialized in the production of surfactants and chemical specialist additives used, i.a. in the metallurgical, textile, refinery and mining, and plastics industry.
Individual inquiries
PCC Group
