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Metal plating agents

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Polymax® ED-P4 (Polyether Polyol) Polymax® ED-P4 is commonly used in the stabilization of electroless copper plating baths. Recommended used levels are 0.25 - 1.0% in the bath.Polymax® ED-P4 belongs...
Composition
Polyether polyols
CAS No.
102-60-3
Polymax® ED-P4 (Polyether Polyol)
Polymax® MAS/80 (Sodium Dihexyl Sulfosuccinate Mixture) Polymax® MAS/80 is an 80% active solution of sodium dihexyl sulfosuccinate. Polymax® MAS/80 exhibits high foaming characteristics and may be used as a wetting/anti-pitting...
Composition
Sulfosuccinates
CAS No.
2373-38-8
Polymax® MAS/80 (Sodium Dihexyl Sulfosuccinate Mixture)
Polymax® NPA-15 (POE (15) Nonyl Phenol) Polymax® NPA-15 is a high foaming electroplating additive that should be used only in applications that can tolerate foam. In matte systems, Polymax®NPA-15 gives...
Composition
Alkoxylated nonylphenols
CAS No.
9016-45-9
Polymax® NPA-15 (POE (15) Nonyl Phenol)
Polymax® PA-660A (Polyalkylene Glycol) Polymax®PA-660A is a low foaming electroplating additive. It is recommended for use in acid zinc and electroless copper plating bath applications. The primary function...
Composition
PAG
CAS No.
9038-95-3
Polymax® PA-660A (Polyalkylene Glycol)
Polymax® PA-671 Polymax® PA-671 is commonly used in acid zinc plating systems to impart wetting properties and in the formulation of non-flammable brightener packages with 2-chlorobenzaldehyde...
Composition
Mixtures
Polymax® PA-671
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